Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)
It is a flexible substrate that combines heat resistance and transparency. FPC
Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.
- Company：サーテック フレキ基板（FPC）ソフトウェア ハードウェア 成膜加工 基板設計
- Price：Other
